 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| ? 2009 microchip technology inc. ds21942e-page 1 mcp9700/9700a mcp9701/9701a features ? tiny analog temperature sensor ? available packages: - sc70-5, sot-23-5, to-92-3 ? wide temperature measurement range: - -40c to +125c (extended temperature) - -40c to +150c (high temperature) (mcp9700/9700a) ? accuracy: - 2c (max.), 0c to +70c ( MCP9700A/9701a) - 4c (max.), 0c to +70c ( mcp9700/9701 ) ? optimized for analog-to-digital converters (adcs): - 10.0 mv/c (typical) mcp9700/9700a - 19.5 mv/c (typical) mcp9701/9701a ? wide operating voltage range: -v dd = 2.3v to 5.5v mcp9700/9700a -v dd = 3.1v to 5.5v mcp9701/9701a ? low operating current: 6 a (typical) ? optimized to drive large capacitive loads typical applications ? hard disk drives and other pc peripherals ? entertainment systems ? home appliance ? office equipment ? battery packs and portable equipment ? general purpose temperature monitoring description the mcp9700/9700a and mcp9701/9701a family of linear active thermistor? intergrated circuit (ic) is an analog temperature sensor that converts temperature to analog voltage. it?s a low-cost, low-power sensor with an accuracy of 2c from 0c to +70c (MCP9700A/9701a) 4c from 0c to +70c (mcp9700/9701) while consuming 6 a (typical) of operating current. unlike resistive sensors (s uch as thermistors), the linear active thermistor ic does not require an additional signal-conditioning circuit. therefore, the biasing circuit development overhead for thermistor solutions can be avoided by implementing this low-cost device. the voltage output pin (v out ) can be directly connected to the adc input of a microcontroller. the mcp9700/9700a and mcp9701/9701a temperature coefficients are scaled to provide a 1c/bit resolution for an 8-bit adc with a reference voltage of 2.5v and 5v, respectively. the mcp9700/9700a and mcp9701/9701a provide a low-cost solution for applicat ions that require measure- ment of a relative cha nge of temperature. when measuring relative change in temperature from +25c, an accuracy of 1c (typical) can be realized from 0c to +70c. this accuracy can also be achieved by applying system calib ration at +25c. in addition, this family is immune to the effects of parasitic capacitance and can drive large capacitive loads. this provides print ed circuit board (pcb) layout design flexibility by enabling the device to be remotely located from the microcontroller. adding some capacitance at the output also helps the output transient response by reducing overshoots or undershoots. however, capacitive load is not required for sensor output stability. package type 3-pin sot-23 mcp9700/9700a mcp9701/9701a 3-pin to-92 12 3 gnd v out v dd bottom view mcp9700/9701 only 1 gnd v dd v out nc 4 1 2 3 5 5-pin sc70 nc mcp9700/9700a mcp9701/9701a gnd v dd v out 3 12 low-power linear active thermistor? ics
mcp9700/9700a and mcp9701/9701a ds21942e-page 2 ? 2009 microchip technology inc. notes: ? 2009 microchip technology inc. ds21942e-page 3 mcp9700/9700a and mcp9701/9701a 1.0 electrical characteristics absolute maximum ratings ? v dd :...................................................................... 6.0v storage temperature: ........................ -65c to +150c ambient temp. with power applied:.. -40c to +150c output current ................................................. 30 ma junction temperature (t j ): ................................ 150c esd protection on all pins (hbm:mm): ....(4 kv:200v) latch-up current at each pi n: ...................... 200 ma ?notice: stresses above those listed under ?maximum ratings? may cause permanent dam age to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. dc electrical characteristics electrical specifications: unless otherwise indicated: mcp9700/9700a: v dd = 2.3v to 5.5v, gnd = ground, t a = -40c to +125c and no load. mcp9701/9701a: v dd = 3.1v to 5.5v, gnd = ground, t a = -10c to +125c and no load. parameter sym min typ max unit conditions power supply operating voltage range v dd v dd 2.3 3.1 ? ? 5.5 5.5 v v mcp9700/9700a mcp9701/9701a operating current i dd ?612a power supply rejection c/ v dd ?0.1?c/v sensor accuracy (notes 1, 2) t a = +25c t acy ?1?c t a = 0c to +70c t acy -2.0 1 +2.0 c MCP9700A/9701a t a = -40c to +125c t acy -2.0 1 +4.0 c MCP9700A t a = -10c to +125c t acy -2.0 1 +4.0 c mcp9701a t a = 0c to +70c t acy -4.0 2 +4.0 c mcp9700/9701 t a = -40c to +125c t acy -4.0 2 +6.0 c mcp9700 t a = -10c to +125c t acy -4.0 2 +6.0 c mcp9701 t a = -40c to +150c t acy -4.0 2 +6.0 c high temperature, mcp9700 only sensor output output voltage, t a = 0c v 0c ?500?mv mcp9700/9700a output voltage, t a = 0c v 0c ?400?mv mcp9701/9701a temperature coefficient t c ?10.0?mv/c mcp9700/9700a t c ?19.5?mv/c mcp9701/9701a output non-linearity v onl ?0.5? ct a = 0c to +70c (note 2) output current i out ? ? 100 a output impedance z out ?20? i out = 100 a, f = 500 hz output load regulation v out / i out ?1? t a = 0c to +70c, i out = 100 a turn-on time t on ?800? s note 1: the mcp9700/9700a family accuracy is tested with v dd = 3.3v, while the mcp9701/9701a accuracy is tested with v dd = 5.0v. 2: the mcp9700/9700a and mcp9701/9701a family is charac terized using the first-order or linear equation, as shown in equation 4-2 . also refer to figure 2-16 . 3: sc70-5 package thermal response with 1x1 inch, dual-sided copper clad, to-92-3 package thermal response without pcb (leaded). mcp9700/9700a and mcp9701/9701a ds21942e-page 4 ? 2009 microchip technology inc. m typical load capacitance c load ? ? 1000 pf the mcp9700/9700a and mcp9701/9701a family is characterized and produc- tion tested with a capacitive load of 1000 pf. sc-70 thermal response to 63% t res ? 1.3 ? s 30c (air) to +125c (fluid bath) ( note 3 ) to-92 thermal response to 63% t res ?1.65? s dc electrical characte ristics (continued) electrical specifications: unless otherwise indicated: mcp9700/9700a: v dd = 2.3v to 5.5v, gnd = ground, t a = -40c to +125c and no load. mcp9701/9701a: v dd = 3.1v to 5.5v, gnd = ground, t a = -10c to +125c and no load. parameter sym min typ max unit conditions note 1: the mcp9700/9700a family accuracy is tested with v dd = 3.3v, while the mcp9701/9701a accuracy is tested with v dd = 5.0v. 2: the mcp9700/9700a and mcp9701/9701a family is charac terized using the first-order or linear equation, as shown in equation 4-2 . also refer to figure 2-16 . 3: sc70-5 package thermal response with 1x1 inch, dual-sided copper clad, to-92-3 package thermal response without pcb (leaded). temperature characteristics electrical specifications: unless otherwise indicated: mcp9700/9700a: v dd = 2.3v to 5.5v, gnd = ground, t a = -40c to +125c and no load. mcp9701/9701a: v dd = 3.1v to 5.5v, gnd = ground, t a = -10c to +125c and no load. parameters sym min typ max units conditions temperature ranges specified temperature range (note 1) t a -40 ? +125 c mcp9700/9700a t a -10 ? +125 c mcp9701/9701a t a -40 ? +150 c high temperature, mcp9700 only operating temperature range t a -40 ? +125 c extended temperature t a -40 ? +150 c high temperature storage temperature range t a -65 ? +150 c thermal package resistances thermal resistance, 5ld sc70 ja ?331? c/w thermal resistance, 3ld sot-23 ja ?308? c/w thermal resistance, 3ld to-92 ja ?146? c/w note 1: operation in this range must not cause t j to exceed maximum junction temperature (+150c). ? 2009 microchip technology inc. ds21942e-page 5 mcp9700/9700a and mcp9701/9701a 2.0 typical performance curves note: unless otherwise indicated, mcp9700/9700a : v dd = 2.3v to 5.5v; mcp9701/9701a : v dd = 3.1v to 5.5v; gnd = ground, c bypass = 0.1 f. figure 2-1: accuracy vs. ambient temperature (MCP9700A/9701a). figure 2-2: accuracy vs. ambient temperature, with v dd . figure 2-3: supply current vs. temperature. figure 2-4: accuracy vs. ambient temperature (mcp9700/9701). figure 2-5: changes in accuracy vs. ambient temperature (due to load). figure 2-6: load regulation vs. ambient temperature. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purpose s only. the performance characteristics listed herein are not tested or guaranteed. in so me graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power suppl y range) and therefore outs ide the warranted range. -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50 -25 0 25 50 75 100 125 150 t a (c) accuracy (c) MCP9700A v dd = 3.3v mcp9701a v dd = 5.0v spec. limits -4.0 -2.0 0.0 2.0 4.0 6.0 -50 -25 0 25 50 75 100 125 150 t a (c) accuracy (c) mcp9701/ mcp9701a v dd = 5.5v v dd = 3.1v mcp9700 MCP9700A v dd = 5.5v v dd = 2.3v 0.0 2.0 4.0 6.0 8.0 10.0 12.0 -50 -25 0 25 50 75 100 125 150 t a (c) i dd (a) mcp9700/MCP9700A mcp9701 mcp9701a -4.0 -2.0 0.0 2.0 4.0 6.0 -50 -25 0 25 50 75 100 125 150 t a (c) accuracy (c) mcp9700 v dd = 3.3v mcp9701 v dd = 5.0v s pec. limits -0.2 -0.1 0 0.1 0.2 -50 -25 0 25 50 75 100 125 150 t a (c) accuracy due to load (c) mcp9701/mcp9701a v dd = 5.0v i load = 100 a mcp9700/mcp9700 a v dd = 3.3 v 0.0 1.0 2.0 3.0 4.0 -50 -25 0 25 50 75 100 125 t a (c) load regulation v/ i ( ? ) mcp9700/MCP9700A mcp9701/mcp9701a v dd = 3.3v i out = 50 a i out = 100 a i out = 200 a mcp9700/9700a and mcp9701/9701a ds21942e-page 6 ? 2009 microchip technology inc. note: unless otherwise indicated, mcp9700/9700a : v dd = 2.3v to 5.5v; mcp9701/9701a : v dd = 3.1v to 5.5v; gnd = ground, c bypass = 0.1 f. figure 2-7: output voltage at 0c (mcp9700/9700a). figure 2-8: occurrences vs. temperature coefficient (mcp9700/9700a). figure 2-9: power supply rejection ( c/ v dd ) vs. ambient temperature. figure 2-10: output voltage at 0c (mcp9701/9701a). figure 2-11: occurrences vs. temperature coefficient (mcp9701/9701a). figure 2-12: power supply rejection ( c/ v dd ) vs. temperature. 0% 5% 10% 15% 20% 25% 30% 35% 400 420 440 460 480 500 520 540 560 580 600 v 0c (mv) occurrences v dd = 3.3v 108 samples MCP9700A mcp9700 0% 5% 10% 15% 20% 25% 30% 35% 40% 45% 9.7 9.8 9.8 9.9 10.0 10.1 10.2 10.2 10.3 10.4 10.5 t c (mv/c) occurrences mcp9700 MCP9700A v dd = 3.3v 108 samples 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -50 -25 0 25 50 75 100 125 150 t a (c) normalized psrr (c/v) mcp9700/MCP9700A v dd = 2.3v to 5.5v mcp9700/MCP9700A v dd = 2.3v to 4.0v 0% 5% 10% 15% 20% 25% 30% 35% 300 320 340 360 380 400 420 440 460 480 500 v 0c (mv) occurrences mcp9701 v dd = 5.0v 108 samples mcp9701a mcp9701 0% 5% 10% 15% 20% 25% 30% 35% 40% 45% 19.2 19.3 19.3 19.4 19.5 19.6 19.7 19.7 19.8 19.9 20.0 t c (mv/c) occurrences mcp9701 mcp9701a v dd = 5.0v 108 samples 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -50 -25 0 25 50 75 100 125 t a (c) normalized psrr (c/v) mcp9701/mcp9701a v dd = 3.1v to 5.5v mcp9701/mcp9701a v dd = 3.1v to 4.0v mcp9701/mcp9701a v dd = 3.1v to 5.5v mcp9701/mcp9701a v dd = 3.1v to 4.0v ? 2009 microchip technology inc. ds21942e-page 7 mcp9700/9700a and mcp9701/9701a note: unless otherwise indicated, mcp9700/9700a : v dd = 2.3v to 5.5v; mcp9701/9701a : v dd = 3.1v to 5.5v; gnd = ground, c bypass = 0.1 f. figure 2-13: output voltage vs. power supply. figure 2-14: output vs. settling time to step v dd . figure 2-15: thermal response (air to fluid bath). figure 2-16: output voltage vs. ambient temperature. figure 2-17: output vs. settling time to ramp v dd . figure 2-18: output impedance vs. frequency. 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 v dd (v) v out (v) t a = +26c 0 2 4 6 8 10 12 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 time (ms) v out (v) -2.5 -1.7 -0.8 0.0 0.8 1.7 2.5 i dd (ma) v dd_step = 5v t a = 26c i dd v out 30 55 80 105 130 -2 0 2 4 6 8 10 12 14 16 18 time (s) t a (c) sc70-5 1 in. x 1 in. copper clad pcb leaded, without pcb sc70-5 sot-23-3 to-92-3 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50-25 0 255075100125 t a (c) v out (v) mcp9700 MCP9700A mcp9701 mcp9701a 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 time (ms) v out (v) -42.0 -30.0 -18.0 -6.0 6.0 18.0 30.0 i dd (a) i dd v out v dd_ramp = 5v/ms t a = +26c 1 10 100 1000 0.1 1 10 100 1000 10000 100000 frequency (hz) output impedance ( ? ) v dd = 5.0v i out = 100 a t a = +26c 1k 10k 100k 100 10 1 0. mcp9700/9700a and mcp9701/9701a ds21942e-page 8 ? 2009 microchip technology inc. notes: ? 2009 microchip technology inc. ds21942e-page 9 mcp9700/9700a and mcp9701/9701a 3.0 pin descriptions the descriptions of the pins are listed ta b l e 3 - 1 . table 3-1: pin function table 3.1 power ground pin (gnd) gnd is the system ground pin. 3.2 output voltage pin (v out ) the sensor output can be measured at v out . the voltage range over the oper ating temperature range for the mcp9700/9700a is 100 mv to 1.75v and for the mcp9701/9701a, 200 mv to 3v . 3.3 power supply input (v dd ) the operating voltage as specified in the ?dc electrical char acteristics? table is applied to v dd . 3.4 no connect pin (nc) this pin is not connected to the die. it can be used to improve thermal conduc tion to the package by connecting it to a printed circuit board (pcb) trace from the thermal source. pin no. sc70 pin no. sot-23 pin no. to-92 symbol function 1 ? ? nc no connect (this pin is not connected to the die). 2 3 3 gnd power ground pin 322v out output voltage pin 411v dd power supply input 5 ? ? nc no connect (this pin is not connected to the die). mcp9700/9700a and mcp9701/9701a ds21942e-page 10 ? 2009 microchip technology inc. notes: ? 2009 microchip technology inc. ds21942e-page 11 mcp9700/9700a and mcp9701/9701a 4.0 applications information the linear active thermistor? ic uses an internal diode to measure temperat ure. the diode electrical characteristics have a te mperature coefficient that provides a change in voltage based on the relative ambient temperature from -40c to 150c. the change in voltage is scaled to a temperature coefficient of 10.0 mv/c (typical) for the mcp9700/9700a and 19.5 mv/c (typical) for the mcp9701/9701a. the out- put voltage at 0c is also scaled to 500 mv (typical) and 400 mv (typical) for the mcp9700/9700a and mcp9701/9701a, respectively. this linear scale is described in the first-order transfer function shown in equation 4-1 and figure 2-16 . equation 4-1: sensor transfer function figure 4-1: typical application circuit. 4.1 improving accuracy the mcp9700/9700a and mcp9701/9701a accuracy can be improved by performing a system calibration at a specific temperature. fo r example, calibrating the system at +25c ambient improves the measurement accuracy to a 0.5c (typical) from 0c to +70c, as shown in figure 4-2 . therefore, when measuring relative temperature change, this family measures temperature with higher accuracy. figure 4-2: relative accuracy to +25c vs. temperature. the change in accuracy from the calibration temperature is due to the output non-linearity from the first-order equation, as specified in equation 4-2 . the accuracy can be further improved by compensating for the output non-linearity. for higher accuracy using a sensor compensation technique, refer to an1001 ?ic temperature sensor accuracy compensation with a picmicro ? microcontroller? (ds01001). the application note shows that if the mcp9700 is compensated in addition to room temperature calibration, the sensor accuracy can be improved to 0.5c (typical) accuracy over the operating temperature ( figure 4-3 ). figure 4-3: mcp9700/9700a calibrated sensor accuracy. the compensation technique provides a linear temperature reading. a firmware look-up table can be generated to compensate for the sensor error. v out t c t a v 0 c + ? = where: t a = ambient temperature v out = sensor output voltage v 0c = sensor output voltage at 0c (see dc electrical characteristics table) t c = temperature coefficient (see dc electrical characteristics table) v dd v ss gnd ani v dd v ss v out mcp9700 picmicro? mcu -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 -50 -25 0 25 50 75 100 125 t a (c) accuracy (c) v dd = 3.3v 10 samples -4.0 -2.0 0.0 2.0 4.0 6.0 -50 -25 0 25 50 75 100 125 temperature (c) accuracy (c) + s average - s spec. limits 100 samples mcp9700/9700a and mcp9701/9701a ds21942e-page 12 ? 2009 microchip technology inc. 4.2 shutdown using microcontroller i/o pin the mcp9700/9700a and mcp9701/9701a family of low operating current of 6 a (typical) makes it ideal for battery-powered applications. however, for applications that require ti ghter current budget, this device can be powered using a microcontroller input/ output (i/o) pin. the i/o pin can be toggled to shut down the device. in such applications, the microcontroller internal digital switching noise is emitted to the mcp9700/9700a and mcp9701/9701a as power supply noise. this switching noise compro- mises measurement accuracy. therefore, a decoupling capacitor and series resistor will be necessary to filter out the system noise. 4.3 layout considerations the mcp9700/9700a and mcp9701/9701a family does not require any additional components to operate. however, it is recommended that a decoupling capacitor of 0.1 f to 1 f be used between the v dd and gnd pins. in high-noise applications, connect the power supply voltage to the v dd pin using a 200 resistor with a 1 f decoupling capacitor. a high frequency ceramic capacitor is recommended. it is necessary for the capacitor to be located as close as possible to the v dd and gnd pins in order to provide effective noise protection. in addition, avoid tracing digital lines in close proximity to the sensor. 4.4 thermal considerations the mcp9700/9700a and mcp9701/9701a family measures temperature by monitoring the voltage of a diode located in the die. a low-impedance thermal path between the die and the pcb is provided by the pins. therefore, the sensor effectively monitors the temperature of the pcb. howe ver, the thermal path for the ambient air is not as efficient because the plastic device package functions as a thermal insulator from the die. this limitation applies to plastic-packaged silicon temperature sensors. if the a pplication requires measuring ambient air, consider using the to-92 package. the mcp9700/9700a and mcp9701/9701a is designed to source/sink 100 a (max.). the power dissipation due to the output current is relatively insignificant. the effect of the output current can be described using equation 4-2 . equation 4-2: effect of self- heating at t a = +25c (v out = 0.75v) and maximum specification of i dd =12a, v dd = 5.5v and i out = +100 a, the self-heating due to power dissipation (t j ?t a ) is 0.179c. t j t a ? ja v dd i dd v dd v out ? () + i out () = where: t j = junction temperature t a = ambient temperature ja = package thermal resistance (331c/w) v out = sensor output voltage i out = sensor output current i dd = operating current v dd = operating voltage ? 2009 microchip technology inc. ds21942e-page 13 mcp9700/9700a and mcp9701/9701a 5.0 packaging information 5.1 package marking information 5-lead sc70 example: xxnn legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part nu mber cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e device code mcp9700t aunn MCP9700At axnn mcp9701t avnn mcp9701at aynn note: applies to 5-lead sc70. au25 3-lead to-92 xxxxxx xxxxxx xxxxxx ywwnnn example: mcp 9700e to^^ 916256 3 e 3-lead sot-23 example: xxnn device code mcp9700t aenn MCP9700At afnn mcp9701t amnn mcp9701at apnn note: applies to 3-lead sot-23 ae25 mcp9700/9700a and mcp9701/9701a ds21942e-page 14 ? 2009 microchip technology inc. !" ! #$! !% # $ !% # $ #&! ! !# "' ( )*+ ) # & #, $ --# $## . # #$ # / ! - 0 # 1 / % # #! # ## +22--- 2 / 3# 44" " 4 # 5 56 7 5$ 8 %1 5 ( 1# 9()* 6, : # ; < !!1 / / ; < # ! %% < 6, =!# " ; !!1 / =!# " ( ( ( 6, 4# ; ( . #4# 4 9 4 ! / ; < 9 4 !=!# 8 ( < d b 1 2 3 e1 e 4 5 ee c l a1 aa2 - *9 ) ? 2009 microchip technology inc. ds21942e-page 15 mcp9700/9700a and mcp9701/9701a . # #$ # / ! - 0 # 1 / % # #! # ## +22--- 2 / mcp9700/9700a and mcp9701/9701a ds21942e-page 16 ? 2009 microchip technology inc. ! !" ! #$! !% # $ !% # $ #&!( ! !# "' ( )*+ ) # & #, $ --# $## . # #$ # / ! - 0 # 1 / % # #! # ## +22--- 2 / 3# 44" " 4 # 5 56 7 5$ 8 %1 5 4 !1# ()* 6$# !4 !1# )* 6, : # ; < !!1 / / ( # ! %% < 6, =!# " < 9 !!1 / =!# " 9 6, 4# 9 ( . #4# 4 ( 9 . # > < > 4 ! / ; < 4 !=!# 8 < ( b n e e1 2 1 e e1 d a a1 a2 c l - * ) ? 2009 microchip technology inc. ds21942e-page 17 mcp9700/9700a and mcp9701/9701a "! !"! #$! !% # $ !% # $ #&!(? ! !# "' ( )*+ ) # & #, $ --# $## . # #$ # / ! - 0 # 1 / % # #! # ## +22--- 2 / 3# 5*:" 4 # 5 7 5$ 8 %1 5 1# ()* ) ## # 1 / . # ( 9( 6, =!# " ( ( 6, 4# !!1 / !$ ; ( # #1 4 ( < 4 ! / 4 !=!# 8 e a n 1 l b e c r d 1 2 3 - * ) mcp9700/9700a and mcp9701/9701a ds21942e-page 18 ? 2009 microchip technology inc. notes: ? 2009 microchip technology inc. ds21942e-page 19 mcp9700/9700a and mcp9701/9701a appendix a: revision history revision e (april 2009) the following is the list of modifications: 1. added high temperature option throughout document. 2. updated plots to reflect the high temperature performance. 3. updated package outline drawings. 4. updated revision history. revision d (october 2007) the following is the list of modifications: 1. added the 3-lead sot-23 devices to data sheet. 2. replaced figure 2-15. 3. updated package outline drawings. revision c (june 2006) the following is the list of modifications: 1. added the MCP9700A and mcp9701a devices to data sheet. 2. added to92 package for the mcp9700/ mcp9701. revision b (october 2005) the following is the list of modifications: 1. added section 3.0 ?pin descriptions?. 2. added the linear active thermistor? ic trademark. 3. removed the 2 nd order temperature equation and the temperature coeficient histogram. 4. added a reference to an1001 and correspond- ing verbiage. 5. added figure 4-2 and corresponding verbiage. revision a (november 2005) ? original release of this document. mcp9700/9700a and mcp9701/9701a ds21942e-page 20 ? 2009 microchip technology inc. notes: ? 2009 microchip technology inc. ds21942e-page 21 mcp9700/9700a and mcp9701/9701a product identification system to order or obtain information, e.g., on pricing or de livery, refer to the factory or the listed sales office . device: mcp9700t: linear active thermistor? ic, tape and reel, pb free MCP9700At: linear active thermistor? ic, tape and reel, pb free mcp9701t: linear active thermistor? ic, tape and reel, pb free mcp9701at: linear active thermistor? ic, tape and reel, pb free temperature range: e = -40 c to +125 c h= -40 c to +150 c (mcp9700 only) package: lt = plastic small outline transistor, 5-lead to = plastic small outline transistor, 3-lead tt = plastic small outline transistor, 3-lead part no. x /xx package temperature range device examples: a) mcp9700t-e/lt: linear active thermistor? ic, tape and reel, 5ld sc70 package. b) mcp9700-e/to: linear active thermistor? ic, 3ld to-92 package. c) mcp9700t-e/to: linear active thermistor? ic, tape and reel, 3ld sot-23 package. d) mcp9700t-h/lt: linear active thermistor? ic, tape and reel, high temperature, 5ld sc70 package. a) MCP9700At-e/lt: linear active thermistor? ic, tape and reel, 5ld sc70 package. b) MCP9700At-e/to: linear active thermistor? ic, tape and reel, 3ld sot-23 package. a) mcp9701t-e/lt: linear active thermistor? ic, tape and reel, 5ld sc70 package. b) mcp9701-e/to: linear active thermistor? ic, 3ld to-92 package. c) mcp9701t-e/to: linear active thermistor? ic, tape and reel, 3ld sot-23 package. a) mcp9701at-e/lt: linear active thermistor? ic, tape and reel, 5ld sc70 package. b) mcp9701at-e/to: linear active thermistor? ic, tape and reel, 3ld sot-23 package. ? mcp9700/9700a and mcp9701/9701a ds21942e-page 22 ? 2009 microchip technology inc. notes: ? 2009 microchip technology inc. ds21942e-page 23 information contained in this publication regarding device applications and the like is prov ided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application me ets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safe ty applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting fr om such use. no licenses are conveyed, implicitly or ot herwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, accuron, dspic, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, rfpic, smartshunt and uni/o are registered trademarks of microchip te chnology incorporated in the u.s.a. and other countries. filterlab, linear active thermistor, mxdev, mxlab, seeval, smartsensor and the embedded control solutions company are registered tradema rks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, a pplication maestro, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, in-circuit serial programming, icsp, icepic, mindi, miwi, mpasm, mplab certified logo, mplib, mplink, mtouch, pickit, picdem, picdem.net, pictail, pic 32 logo, powercal, powerinfo, powermate, powertool, real ice, rflab, select mode, total endurance, wiperlock and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2009, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal meth ods used to breach the code protection fe ature. all of these methods, to our knowledge, require using the microchip pr oducts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your softwa re or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperi pherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. ds21942e-page 24 ? 2009 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://support.microchip.com web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 cleveland independence, oh tel: 216-447-0464 fax: 216-447-0643 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 kokomo kokomo, in tel: 765-864-8360 fax: 765-864-8387 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 santa clara santa clara, ca tel: 408-961-6444 fax: 408-961-6445 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2401-1200 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8528-2100 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - hong kong sar tel: 852-2401-1200 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8203-2660 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 asia/pacific india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4080 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-2566-1512 fax: 91-20-2566-1513 japan - yokohama tel: 81-45-471- 6166 fax: 81-45-471-6122 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-6578-300 fax: 886-3-6578-370 taiwan - kaohsiung tel: 886-7-536-4818 fax: 886-7-536-4803 taiwan - taipei tel: 886-2-2500-6610 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 uk - wokingham tel: 44-118-921-5869 fax: 44-118-921-5820 w orldwide s ales and s ervice 03/26/09 |
Price & Availability of MCP9700A
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |